♦機台特色♦

◎Wafer size 300 mm (12”)

◎Sorting of two wafer sizes in one machine

◎Robot with FOSB mapping function

◎Pre-aligner module for 200 mm (8”) and 300 mm (12”) wafer

◎Cross slot wafer detection

◎Wafer protrusion detection

◎Touch screen display

◎Top side OCR module

◎Windows PC-Based user friendly Graphical User Interface

◎Wafer sorting selection by recipe or operator

◎Live sorting Graphical User Interface

◎Up to 180 WPH

♦選配♦

◎Wafer size 200 mm (8”)

◎SECS/GEM

◎Wafer-ID reader for OCR and barcode

◎Dual end effector for maximum throughput

◎Vision pre-aligner for 200 mm (8”) and 300 mm (12”) wafer (only top OCR configuration available)

◎Auto recipe selection

◎UPS (uninterruptable power supply)

◎CDA and N2 pressure indicator

◎Bottom side OCR module

◎Additional 3rd Load port for Split and Merging